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About Spirox
SPIROX
About Spirox
Spirox
Jetek
Southport
Products
PRODUCTS
Products
Spirox Laser Tomography Scan System
Non-Destructive TGV Laser Modification Inspection System
Non-Destructive TSV Inspection System
Semiconductor IC Testing Equipment
ATE
Handler
Prober
Interface
Semiconductor Packaging Equipment
Reflow Oven
Plasma Cleaner
TCB Bonder
Automatic Wirebonding Measurement Equipment
Warpage Adjustment
Thermal Debonding
Lab Wafer and Chip Inspection Equipment
Surface Topography Inspection and Material Characteristic Analysis
Defect Inspection
FA
ESD
Mass Production Chip Inspection Equipment
Automated Optical Inspection (AOI)
Defect Inspection
ATE/Prober Board Repair Service
ATE/Prober Board Repair Service
Accessories
Chuck
Probe Pin
Automation Equipment
Silicon Materials and Wafers
Applications
APPLICATIONS
Applications
Advanced Packaging
TGV Laser Modification Inspection
TSV Defect Inspection
CPO(Co-Packaged Optics)
CoWoS
Hybrid Bonding
Reflow
Raman/PL Spectroscopy
Jewelry, Antiquities, & Material Analysis
Semiconductor & MicroLED Research
Toxicology & Environmental Testing
Biomedical Testing
Photoluminescence, PL
Surface Topography Inspection
MicroLED Inspection
Single-Molecule Imaging
Biomedical Imaging
Material Surface Distribution Analysis
SiC/GaN Inspection
RF Front-End Module (FEM)
PA, LNA
RF Switch, RF Filter, RF FEM
Sub-6, mmWave
Digital & Mixed Signals
MCU, AD/DAC, Audio/Video
RF & Wireless
MEMS & Sensors Connectivity
MEMS Sensor Device
Magnetometer
Accelerometer
MEMS Microphone
Gyroscope
Pressure Sensor
Power Semiconductor Test
Known Good Die (KGD)
Direct Bonded Copper (DBC)
Power Device
Power Module
Power Device/Module Reliability Test
Power Module Packaging
Power Module Pin Insertion
Compound Semiconductor
Defect Inspection
Known Good Die (KGD) Test
Direct Bonded Copper (DBC)
Power Device
Power Module
Power Device/Module Reliability Test
Power Module Packaging
Power Module Pin Insertion
Failure Analysis
EFA
ESD
Semiconductor Packaging
Reflow
Vacuum Reflow
Plasma Cleaning
TCB Bonder
Wire Bond Measurement
Multi-Layer Thickness Measurement
eWLB Warpage Adjustment
eWLB Thermal Debonding
Partners
News
NEWS
News
Latest News
Financial News
Events
Latest News
Financial News
Events
Human Resource
HUMAN RESOURCE
Human Resource
Overview
Core Value
Career Development
Compensation & Benefits
Spirox Life
Join Spirox
Investors
INVESTORS
Investors
Company Information
Organization
Department Functions
Internal Policies and Principles
Corporate Sustainability
Stakeholder Engagement
Corporate Governance
Corporate Governance Structure
Board of Directors
Functional Committees
Performance Evaluation of the BOD & Committees
Internal Audit
Ethical Corporate Management
Irregular Business Conduct Reporting
Human Rights Policy
Intellectual Property Management Plan
Financial Information
Monthly Revenue
Quarterly and Annual Reports
Shareholder Services
Material Information
Dividends
Shareholders' Meeting
Major Shareholders
Earnings Conference
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Major Shareholders
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